Model	Form Factor	CPU Options	Memory Capacity	Storage Bays	GPU Slots
NF5466M6	4U	2× Intel Xeon Gold (up to 28 cores ea.)	Up to 2 TB DDR4	24×3.5″ hot-swap	4× FH PCIe
NF5466M5	4U	2× Intel Xeon Silver/Gold	Up to 1 TB DDR4	24×3.5″ hot-swap	2× FH PCIe
NF5468M6	4U	2× Intel Xeon Silver/Gold	Up to 1 TB DDR4	16×3.5″ + GPU trays	8× FH PCIe
NF8480M6	2U	1× Intel Xeon Gold 5315Y/6330A	Up to 512 GB DDR4	8×2.5″ NVMe	2× FH PCIe
NF8260M5	2U	2× Intel Xeon Gold	Up to 512 GB DDR4	8×2.5″ SAS/SATA	8× FH PCIe
NF5280M6	2U	1× Intel Xeon Silver/Gold	Up to 256 GB DDR4	8×2.5″ SAS/SATA	4× LP PCIe
NF5270M6	2U	2× Intel Xeon Silver	Up to 256 GB DDR4	8×2.5″ or 4×3.5″	–

Category	Model Series	Form Factor	CPU Family	Max GPUs	Drive Bays
X14 Servers	SYS-112C-TN, SYS-112H-TN, SYS-122H-TN, SYS-112B-WR	1U	Intel Xeon Scalable Gen4	–	Up to 4× U.3 or 8×2.5″
	SYS-212H-TN, SYS-222H-TN, SYS-522B-WR	2U	Intel Xeon Scalable Gen4	–	Up to 12× U.3 or 24×2.5″
GPU Servers	AS-4124GO-NART+	4U	Intel Xeon Scalable	4–8	12× U.3 + GPU trays
	AS-4125GS-TNRT2, AS-5126GS-TNRT, AS-5126GS-TNRT2	4U/5U	Intel Xeon Scalable H13/H14	8	16× U.3 + GPU trays
AMD Servers	AS-1115CS-TNR-G1, AS-1115HS-TNR-G1, AS-1125HS-TNR-G1	1U	AMD EPYC™ 7003/7004 Series	–	Up to 8×2.5″
	AS-2015CS-TNR-G1, AS-2015HS-TNR	2U	AMD EPYC™ 7003/7004 Series	–	Up to 12×2.5″

Component	Specification
Model	#BPL-305 Balance 305
Part Number (PN)	BPL-305
WAN Ports	3× 10/100/1000 Mbps GE SFP ports
LAN Ports	3× 10/100/1000 Mbps GE SFP ports
Bypass Ports	2× LAN bypass ports
Throughput	1 Gbps aggregate forwarding
SpeedFusion Peers	2 peers (expandable to 30 with BPL-305-SPF license)
Management	LCD panel, web interface, InControl 2 cloud management
Form Factor	1U rackmount (19″), USB console, optional rack ears
Power	100–240 VAC input, redundant support

Series	Form Factor	Uplinks	Stack/Chassis	Throughput
Catalyst 9300	1U fixed	4× 10G/25G	StackWise-480 (8 members)	480 Gbps
Catalyst 9400	Chassis (5-slot)	10G/25G modules	5-slot, field-replaceable	9 Tbps
Catalyst 9500	1U fixed	4× 40G/100G	N/A	25.6 Tbps
Catalyst 9600	Chassis (3-slot)	40G/100G modules	3-slot, redundant SUPs	25.6 Tbps
Nexus 3000	1U fixed	10/25/40/100G	N/A	2.56 Tbps
Nexus 3550	1U fixed	100G QSFP28	N/A	3.2 Tbps
Nexus 7000	Chassis (8-slot)	10/40G modules	8-slot with redundant SUP	28.8 Tbps
Nexus 9000	1U/2U fixed	25/50/100G	N/A	25.6 Tbps
Business 110	Desktop/1U	Unmanaged 1G	N/A	Up to 128 Gbps
Business 250	1U fixed	10G uplinks	N/A	Up to 176 Gbps
Business 350	1U fixed	10G uplinks	Layer 3 Lite	Up to 280 Gbps

Component	Specification
Model	SA5456M5
CPUs	2× Intel® Xeon® Gold 6152 (22 cores/44 threads, 2.10 GHz/3.70 GHz)
Memory	12×64 GB DDR4 RDIMM @ 2666 MT/s (768 GB total)
Storage	60×16 TB Seagate® Exos® X16 HDDs (960 TB raw)
Networking	1× Intel® XL710-QDA1 40 GbE QSFP+ PCIe 3.0 x8
Chassis	4U rack-mountable; hot-swap 3.5″ drive bays; redundant PSUs and fans
Expansion Slots	8× PCIe 3.0 slots for OCP/GPU/NVMe modules
Management	IPMI with web GUI and Redfish API support

Component	Description	Part Number (PN)
Chassis	ATCA 16-slot chassis with shelf managers and fan modules	C112648
CPU Blade	Dual-socket central processing unit blade	C112772
Storage Module	Storage blade with SAS HDDs	C112773
Power Module	Shelf power module	C112695
Hub Blade	Connectivity blade for ATCA system	C112671
Rear Transition Module	RTM for hub blade	C112670
Carrier Blade	AMC carrier blade	C111975
DSP Blade	Digital signal processor blade	C112635

Dell PowerEdge R660 듀얼 Xeon 골드 6542Y | 64GB DDR5 | 퍼크 H755 | 1.92TB SSD | 1,800W 예비 PSU...

평점: 4

Dell PowerEdge R660 듀얼 Xeon 골드 6542Y | 64GB DDR5 | 퍼크 H755 | 1.92TB SSD | 1,800W 예비 PSU

제품 카테고리:서버
부품 번호:Dell PowerEdge R660
재고 상태:In Stock
상태:새 상품
제품 특징:즉시 배송 가능
최소 주문 수량:1 개
기존 가격:$19,999.00
현재 가격: $16,329.00 절약액 $3,670.00
지금 채팅하기 이메일 전송

안심하세요. 반품 가능합니다.

배송: 국제 배송 시 통관 절차 및 추가 요금이 발생할 수 있습니다. 자세히 보기

배송 기간: 국제 배송이 통관 절차의 영향을 받을 경우 추가 시간이 소요될 수 있습니다. 자세히 보기

반품: 14일 이내 반품 가능합니다. 판매자가 반품 배송비를 부담합니다. 자세히 보기

무료 배송. NET 30 Days 구매 주문을 받습니다. 신용에 영향을 주지 않고 몇 초 만에 승인받으세요.

대량 구매가 필요하신 Dell PowerEdge R660 제품은 Whatsapp: (+86) 151-0113-5020 무료 전화로 문의하시거나 라이브 채팅에서 견적을 요청해 주시면 영업 담당자가 곧 연락드립니다.

Title

Dell PowerEdge R660 Dual Xeon Gold 6542Y | 64 GB DDR5 | PERC H755 | 1.92 TB SSDs | 1,800W Redundant PSU

Keywords

Dell PowerEdge R660, Xeon Gold 6542Y, 64 GB DDR5-5600, PERC H755 RAID, 1.92 TB SSD, dual 1800W PSU, Broadcom 57414 10/25GbE NIC, iDRAC9 Enterprise

Description

This configuration of the Dell PowerEdge R660 is a robust, enterprise-grade server built for compute, storage, and network intensive workloads.

As per Dell’s spec sheet, R660 supports dual next-generation Intel Xeon Scalable CPUs, up to 10 front 2.5″ drive bays, and integrated management features.

Your system is equipped with **dual Intel Xeon Gold 6542Y** processors (24 cores / 48 threads, DDR5-5200 support, 250W TDP).

The “Performance Heatsink for 2 CPU” setting is used to support higher thermal budgets in this dual-CPU setup. The configuration explicitly states “No HBM” (no High Bandwidth Memory), so standard memory channels are used.

Memory in this build totals **16 × 64 GB DDR5-5600 RDIMM** (dual rank), which is a very high capacity configuration.

This supports memory-intensive tasks like large databases or in-memory caching. The “Performance Optimized” memory profile is applied to maximize throughput.

The storage controller is a **PERC H755** with rear load brackets. Two **1.92 TB SATA SSDs** (mixed use, 6 Gbps, 512e, hot-plug) are included.

The RAID configuration is currently “C7, Unconfigured RAID (mixed drive types allowed)” giving you flexibility to choose your RAID level (RAID 1, 5, 10, etc.).

On the networking side, you have a **Broadcom 57414 dual-port 10/25GbE OCP NIC**, plus a Broadcom 5720 dual 1GbE LOM and optionally an Intel i350 quad 1GbE adapter.

There's also a fibre channel HBA (Emulex LPe35002) included for SAN connectivity.

Power is backed by **dual 1,800W Titanium redundant (1+1) PSUs**, giving ample power overhead for heavy workloads. Cooling is handled via **4 very high performance fans**.

The system includes **iDRAC9 Enterprise 16G** for remote management and **TPM 2.0 V6** for platform security.

Key Features

Dual Intel Xeon Gold 6542Y (24C/48T each) for strong multi-threaded performance
High memory capacity: 16 × 64 GB DDR5-5600 RDIMMs
PERC H755 RAID controller with rear load bracket—support for mixed drives
Two 1.92 TB SATA SSDs (hot-plug) for fast storage I/O
Dual 1,800W Titanium redundant PSUs for high power headroom and reliability
Broadcom 57414 10/25GbE OCP NIC and additional networking options (1GbE, 4x1GbE, FC HBA)
iDRAC9 Enterprise, TPM 2.0 V6, and security / management features built in
ReadyRails sliding rails with Cable Management Arm, high-performance fans, and robust chassis design

Configuration

Module / Part	Selected Option
Base	PowerEdge R660 Server (210-BEQQ)
TPM	Trusted Platform Module 2.0 V6
Chassis	2.5″ chassis supporting up to 10 SAS/SATA drives, 2 CPU, PERC11 backplane
Processor 1	Intel Xeon Gold 6542Y (24C/48T, DDR5-5200)
Processor 2	Intel Xeon Gold 6542Y (same)
Processor Feature	No HBM
Thermal Configuration	Performance Heatsink for ≥250W CPU configuration
Memory Profile	Performance Optimized
Memory Type / Speed	RDIMM, 5600 MT/s
Memory Capacity	16 × 64 GB modules (dual rank)
RAID Configuration	C7: unconfigured RAID (mixed drive types allowed)
RAID Controller	PERC H755 with rear load bracket
Drives	2 × 1.92 TB SATA SSD (6 Gbps, mixed use, hot-plug)
BIOS Setting	Power Saving mode
Boot Mode	UEFI GPT
Fans	4 Very High Performance
PSU	Dual 1,800W Titanium redundant (1+1)
Power Cords	2 × C15/14 2m PDU style
PCIe Riser	Riser config 1, 3 × x16 LP (Gen4)
Motherboard Constraint	MLK board supports only CPUs < 250W
Network Adapter	Broadcom 57414 dual 10/25GbE OCP NIC
Additional NICs	Broadcom 5720 1GbE LOM, Intel i350 quad 1GbE
Fibre Channel Adapter	Emulex LPe35002 32G FC HBA
Bezel / BOSS / Other	No bezel, no BOSS card, no Quick Sync
Management / Security	iDRAC9 Enterprise 16G, TPM 2.0 V6
Rails / Chassis Accessories	ReadyRails with CMA
Warranty / Deployment	12-month parts only; ProDeploy services

Compatibility

The R660 supports dual Intel Xeon Scalable processors per Dell’s specifications.

The “MLK” motherboard version you have is constrained to CPUs below 250W, which matches your choice of Gold 6542Y (TDP 250W) and disallows higher-TDP CPUs.

Memory support in R660 includes DDR5 RDIMMs. Dell’s spec sheet indicates support for DDR5 up to 4800 MT/s under certain DIMM population modes.

With 16 high-capacity modules you may not hit the top speed depending on slot population and memory topology.

The chassis option “2.5″ chassis with up to 10 drives” is one of the supported drive backplane options for R660.

This allows for a mix of SAS, SATA, or NVMe drives depending on your backplane configuration.

PERC H755 is a valid RAID controller in Dell’s server lineup; using the rear load bracket is consistent with backplane or cabling requirements. Mixed drive types (SAS/SATA) are supported per your RAID configuration option.

Network adapters (10/25GbE OCP, 1GbE, FC HBA) are typical expansions for these systems, provided the server has the proper PCIe / OCP slots and firmware support.

iDRAC9 Enterprise is natively supported on the R660 platform.

Power supply options include Titanium efficiency modules up to high wattages.

Your dual 1,800W PSUs provide excellent headroom. Cooling with high performance fans aligns with CPU TDP selections and dense memory/drive configuration.

Usage Scenarios

1) Virtualization & Hosting: With dual 24-core CPUs, high memory capacity, and SSD storage, this server is well suited for running multiple virtual machines, containers, or hybrid cloud hosts.

2) Database / Analytics: Use the SSDs as fast data tier or log tier, while memory supports large in-memory caching. The compute cores help with heavy transaction workloads.

3) Storage / Cache Node: As part of a storage stack, this server can serve as a caching layer or front end, accelerating hot data paths.

4) High-Speed Networking Gateway: With 25GbE capability, it can act as a network bridge, firewall, or application gateway in demanding environments.

5) SAN / Fibre Channel Integration: The presence of FC HBA allows it to connect directly to SAN fabric—ideal for combining block I/O, compute, and storage functions in one node.

Frequently Asked Questions

Q: Can I upgrade to a higher TDP CPU (e.g. > 250W) later?
A: No — your motherboard (MLK variant) is constrained to CPUs under 250W, as indicated in your configuration. Attempting to install a higher TDP CPU may cause compatibility or thermal issues.
Q: Will all 16 memory modules run at full 5600 MT/s?
A: Probably not. In high population states, memory speed may drop depending on channel and DIMM distribution. You might see lower speeds depending on load and configuration.
Q: What RAID level should I use for the two 1.92 TB SSDs?
A: With two SSDs, RAID 1 (mirroring) is a common choice for redundancy. If you add more drives later, you could move into RAID 5 or RAID 10 for performance + protection.
Q: Are there limitations on PCIe expansions with your chosen riser and OCP NIC?
A: You have “riser config 1, Low Profile, 3 × x16 LP (Gen4)” and an OCP NIC 3.0 slot. This gives you flexibility, but be mindful of lane assignment, slot interference, and power delivery when adding high bandwidth cards.